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個人認知這件事封裝廠和晶圓代工廠要負的責任應該比Nvidia大很多, 尤其是封裝廠. 因為很顯然這是封裝材料和晶片本身熱膨脹係數差太多所產生的問題. 假如我沒記錯, 這些晶片所採用的是Flip-Chip封裝, 換言之, 熱膨脹係數差異產生的問題可能是晶片上的金屬凸塊係數和預期有差異, 但也有可能是封裝材料(那堆環氧樹酯之類的東西)的膨脹係數跟原始設計有差異. 這兩種可能狀況, 封裝廠都要負大部分的責任. 另一種可能的狀況就是金屬凸塊跟晶片本身脫離, 如此一來晶片代工廠就會被牽拖到.
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Reader Comments (Page 1 of 1)
Chris Han @ Jul 11th 2008 2:27AM
個人認知這件事封裝廠和晶圓代工廠要負的責任應該比Nvidia大很多, 尤其是封裝廠. 因為很顯然這是封裝材料和晶片本身熱膨脹係數差太多所產生的問題. 假如我沒記錯, 這些晶片所採用的是Flip-Chip封裝, 換言之, 熱膨脹係數差異產生的問題可能是晶片上的金屬凸塊係數和預期有差異, 但也有可能是封裝材料(那堆環氧樹酯之類的東西)的膨脹係數跟原始設計有差異. 這兩種可能狀況, 封裝廠都要負大部分的責任. 另一種可能的狀況就是金屬凸塊跟晶片本身脫離, 如此一來晶片代工廠就會被牽拖到.