3G 版 iPhone 基頻處理晶片相關資料被挖出？

由 Casper Kao 於 Apr 9th 2008 @ 2:00PM 發表

ZiPhone 團隊最近在 iPhone 2.0 版韌體（beta）中發現一段神祕的代號，看起來似乎有可能就是下一版、3G 版本（？） iPhone 當中基頻處理晶片的辨識代號。

這組 SGOLD3 代號，可能就是代表 Infineon 的 S-GOLD3H（PMB8878）這顆晶片，比前代（S-GOLD2）更進步的地方，除了支援 HSDPA（7.2Mbps）、多媒體播放及影片加速運算能力等功能之外，也可以處理（最高）五百萬畫素相機所拍攝的照片，甚至還有 DVB-H 數位電視廣播接收模組、2倍速的 MMS/SD 記憶卡介面。

所以到時候如果真的是用這顆，就代表 iPhone 可以開外掛成這樣嗎？可別忘了蘋果 "閹割" 的技術是一流的啊！

[出自 ZiPhone; thanks Adam B.]

[原文連結]

註：引用來源為 .pdf 檔

文章分類: 手機

Tags: baseband, chip, Infineon, iPhone, S-GOLD3H

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Reader Comments (Page 1 of 1)

Neutral

SamChiu @ Apr 10th 2008 3:57AM

至少DVB-H模組會先被閹割吧,在美國根本沒有DVB-H的服務,有模組也沒用啊~

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